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Agenda 2026

08:25
5 min

Welcome by moderator of first session, Eric Varton

5 min
Eric Varton Eric Varton VP of Engineering,
Yazaki North America, Inc.
08:30
30 min

Tier 1 Perspective on E/E Architecture to Enable Next Generation Supply Chain

30 min
Dr. Frédèric Holzmann Dr. Frédèric Holzmann Head of Electrics & Electronics Architecture
LEONI Bordnetz-Systeme
09:00
30 min

Bridging Design and Automation: The Next Evolution of Wire Harness Manufacturing

30 min
Boming Zhu Boming Zhu General Manager - Overseas Business
Linquan Technology
09:30
30 min

Powering the Software-defined Vehicle: Creating a Fail-operational Zonal Ecosystem

30 min
Manoj Singh Manoj Singh Global Product Line Director
FORVIA HELLA
10:00
45 min

Coffee break & Networking in the Exhibition

45 min
10:45

Second session moderated by Vijy Koshy

Vijy Koshy Vijy Koshy Sr. Engineering Director
Molex
10:45
30 min

Unlocking the Full Power of 3D Electrical Design

30 min
Douglas Burcicki Douglas Burcicki Senior Director Automotive & Heavy Equipment, Market and Business DevelopmentSiemens Digital Industries Software
 Chad Holley Chad Holley Manager Capital Connectivity Product Management, Siemens Digital Industries Software
11:15
25 min

Innovative Laser Welding Process of Cables for Power Electronics

25 min
Dr. Woo-Sik Chung Dr. Woo-Sik Chung Global Business Development Manager for Automotive & Industrial Electronics
TRUMPF Laser- & Systemtechnik SE
11:40
25 min

Improving Durability of Ultrasonic Welding Tooling for Wire Harness Applications

25 min
Dr. Amin Moghaddas Dr. Amin Moghaddas Applications Engineer
EWI (Edison Welding Institute)
12:05
25 min

From Best-Cost Engineering to Scalable Engineering Intelligence

25 min
Armin Hager Armin Hager CEO
aivato North America
12:30
25 min

Virtual Evaluation of Silicone Elastomer Ageing and its Impact and Interaction with Harness Components

25 min
Leopold Pühringer Leopold Pühringer Global Manager of Research and Development
Starlim
12:55

Closing speech by Vijy Koshy

Vijy Koshy Vijy Koshy Sr. Engineering Director
Molex
13:00

Joint lunch sponsored by Telsonic

14:00
90 min

Optional site tour at Caresoft in Southfield, Michigan

90 min

Shuttle bus starts at 2:00 pm

Guided tours at Caresoft start at 2:30 pm

16:00

Return to The Henry Hotel by shuttle bus

AGENDA 2026

Look out for more updates to the agenda coming soon.